Semiconductor Equipment & Materials
|
Stock Symbol |
Company Name |
DARS™ Rating [?] |
Dividend Yield** |
Current Price* |
Annual Dividend |
Ex-Div Date |
Pay Date |
| KLAC | KLA Tencor | Login/Signup for Ratings | 2.76% | 50.77 | 1.40 | 11/9 | 12/1 |
| AMAT | Applied Materials | Login/Signup for Ratings | 2.44% | 13.11 | 0.32 | 2/21 | 3/15 |
| COHU | Cohu Inc. | Login/Signup for Ratings | 1.90% | 12.66 | 0.24 | 3/2 | 4/20 |

FREE Dividend Stock Newsletter
Get the Dividend.com email newsletter to receive:
- A free copy of our acclaimed report, 5 Rules of Winning Dividend Stock Investing
- Free daily investing tips and picks from Dividend.com CEO Paul Rubillo
- Tons of great market analysis and recommendations





RSS Feeds